US Patent Issued to Taiwan Semiconductor Manufacturing on April 7 for "Package structure with enhancement structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,018, issued on April 7, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package structure with enhancement structure and manufacturing method thereof" was invented by Cheng-Yu Kuo (Kaohsiung City, Taiwan), Yu-Ching Lo (Hsinchu City, Taiwan), Wei-Jie Huang (New Taipei City, Taiwan), Ching-Pin Yuan (Hsinchu City, Taiwan), Yi-Che Chiang (Hsinchu, Taiwan), Kris Lipu Chuang (Hsinchu City, Taiwan), Hsin-Yu Pan (Taipei, Taiwan), Yi-Yang Lei (Taichung City, Taiwan), Ching-Hua Hsieh (Hsinchu, Taiwan) and Kuei-Wei Huang (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes a die, a fi...