US Patent Issued to Altera on April 7 for "Homogenous die stacking with increased element density" (American, Indian Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,021, issued on April 7, was assigned to Altera Corp. (San Jose, Calif.).

"Homogenous die stacking with increased element density" was invented by Mahesh K. Kumashikar (Bangalore, India), Dheeraj Subbareddy (Portland, Ore.), Ankireddy Nalamalpu (Portland, Ore.), MD Altaf Hossain (Portland, Ore.) and Atul Maheshwari (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit device includes multiple microbumps and a top programmable fabric die including a first programmable fabric and a first microbump interface coupled to the multiple microbumps. The integrated circuit device also includes a base programmable fabric die havin...