ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,838, issued on Nov. 3, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei City, Taiwan). "Chip package structure and method for p... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,840, issued on Nov. 3, was assigned to CANON MACHINERY INC. (Shiga, Japan). "Position alignment device, position alignment method, bonding d... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,841, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package having a blocking layer ... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,842, issued on Nov. 3, was assigned to BEIJING YOUZHUJU NETWORK TECHNOLOGY Co. LTD. (Beijing). "Chip and method for forming the same, and pa... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,843, issued on Nov. 3, was assigned to DENSO Corp. (Kariya-city, Japan). "Semiconductor device" was invented by Taro Igoshi (Kariya-city, Ja... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,844, issued on Nov. 3, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Method of fabricating semiconduct... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,845, issued on Nov. 3, was assigned to CR RUNAN TECHNOLOGIES (CHONGQING) Co. LTD. (Chongqing, China). "Manufacturing method for a die includ... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,846, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Release film and method of manufacturing semic... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,847, issued on Nov. 3, was assigned to Intel Corp. (Santa Clara, Calif.). "Integrating and accessing passive components in wafer-level packa... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,848, issued on Nov. 3, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor module and semiconductor device" was invente... Read More