US Patent Issued to BEIJING YOUZHUJU NETWORK TECHNOLOGY on Nov. 3 for "Chip and method for forming the same, and package structure" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,842, issued on Nov. 3, was assigned to BEIJING YOUZHUJU NETWORK TECHNOLOGY Co. LTD. (Beijing).

"Chip and method for forming the same, and package structure" was invented by Haiying Chen (Beijing), Lin Liu (Beijing), Meng Mei (Beijing), Jifeng Li (Beijing) and Jian Wang (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the present disclosure provides a chip and a method of forming the same and a package structure, the chip includes a base substrate and conductive bumps located on the base substrate, a planar shape of each bump has a long axis and a short axis extending through a center of the bump, a length of the long axis is gre...