US Patent Issued to CANON MACHINERY on Nov. 3 for "Position alignment device, position alignment method, bonding device, bonding method, and method for manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,840, issued on Nov. 3, was assigned to CANON MACHINERY INC. (Shiga, Japan).

"Position alignment device, position alignment method, bonding device, bonding method, and method for manufacturing semiconductor device" was invented by Shinya Kawai (Shiga, Japan) and Yusuke Kubota (Shiga, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a position alignment device including: a positional relationship detector configured to detect a positional relationship between a target mark position registered by a pickup-side registration part and a target mark position registered by a bonding-side registration part; a pickup-side offset amount detector...