US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Semiconductor package having a blocking layer on a solder ball" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,841, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package having a blocking layer on a solder ball" was invented by Hansung Ryu (Suwon-si, South Korea), Yongsung Park (Suwon-si, South Korea), Jongbeom Park (Suwon-si, South Korea), Junho Lee (Suwon-si, South Korea) and Jihyun Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first substrate, a first bonding pad on the first substrate, a solder ball on the first bonding pad, and a blocking layer on the solder ball, wherein a thickness of the blocking layer varies in a direction away from...