ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,672, issued on Nov. 3, was assigned to CANSEMI TECHNOLOGY INC. (Guangdong, China). "Method of manufacturing metal interconnection line based... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,673, issued on Nov. 3, was assigned to SEMES Co. LTD. (Cheonan-si, South Korea). "Method of forming semiconductor device and substrate proce... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,674, issued on Nov. 3, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.). "Method of making high aspect ratio openings using mult... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,675, issued on Nov. 3, was assigned to Taiwan Semiconductor Manufacturing Comapny Ltd. (Hsinchu, Taiwan). "Semiconductor device and manufact... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,676, issued on Nov. 3, was assigned to Winbond Electronics Corp. (Taichung City, Taiwan). "Manufacturing method of overlay mark" was invente... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,677, issued on Nov. 3, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Material layer deposition methods, semiconductor processi... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,678, issued on Nov. 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Dynamic exhaust for chemical processi... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,679, issued on Nov. 3, was assigned to SEMES Co. LTD. (Chungcheongnam-Do, South Korea). "Integrated exhaust duct and substrate processing ap... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,680, issued on Nov. 3, was assigned to LINTEC Co. LTD. (Shiga, Japan). "Vaporizer" was invented by Hirofumi Ono (Otsu, Japan). According to... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,681, issued on Nov. 3, was assigned to DISCO Corp. (Tokyo). "Method of handling wafer" was invented by Masaru Nakamura (Tokyo) and Kohei Tsu... Read More