US Patent Issued to Winbond Electronics on Nov. 3 for "Manufacturing method of overlay mark" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,676, issued on Nov. 3, was assigned to Winbond Electronics Corp. (Taichung City, Taiwan).

"Manufacturing method of overlay mark" was invented by Chiao-Ling Hsu (Kaohsiung, Taiwan) and Isao Tanaka (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A manufacturing method of an overlay mark including the following steps is provided. A first mask ring is formed on a target layer. A first dielectric layer is formed on the first mask ring. A second mask ring is formed on the first dielectric layer. The second mask ring, the first dielectric layer and the first mask ring are patterned to form a third mask ring on the target layer correspondin...