US Patent Issued to Sandisk Technologies on Nov. 3 for "Method of making high aspect ratio openings using multiple cladding masks and apparatus for implementing the same" (California Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,674, issued on Nov. 3, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.).

"Method of making high aspect ratio openings using multiple cladding masks and apparatus for implementing the same" was invented by Roshan Jayakhar Tirukkonda (Milpitas, Calif.), Rahul Sharangpani (Fremont, Calif.), Senaka Kanakamedala (San Jose, Calif.) and Raghuveer S. Makala (Campbell, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes forming an alternating stack of first material layers and second material layers over a substrate, forming an etch mask material layer over the alternating stack, loading the etch mask material layer, the altern...