US Patent Issued to CANSEMI TECHNOLOGY on Nov. 3 for "Method of manufacturing metal interconnection line based on gradient over-etch and ammonium fluoride treatment and metal interconnection line" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,672, issued on Nov. 3, was assigned to CANSEMI TECHNOLOGY INC. (Guangdong, China).

"Method of manufacturing metal interconnection line based on gradient over-etch and ammonium fluoride treatment and metal interconnection line" was invented by Zhongkui Chen (Guangdong, China) and Fanshun Meng (Guangdong, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a metal interconnection line and a method of manufacturing the same. The method includes: providing a wafer on which a metal layer comprising an Al layer is formed; performing an ME process on the Al layer using a chlorine-containing gas, thereby removing a partial thi...