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US Patent Issued to NANYA TECHNOLOGY on Oct. 20 for "Manufacturing method of semiconductor structure" (Taiwanese Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,770, issued on Oct. 20, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Manufacturing method of semiconductor structure"... Read More


US Patent Issued to UTAC Headquarters on Oct. 20 for "Wafer adaptors, including systems and methods, for adapting different sized wafers" (Singaporean Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,771, issued on Oct. 20, was assigned to UTAC Headquarters Pte. Ltd. (Singapore). "Wafer adaptors, including systems and methods, for adapti... Read More


US Patent Issued to Applied Materials on Oct. 20 for "Mitigation of first wafer effect" (California Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,772, issued on Oct. 20, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Mitigation of first wafer effect" was invented by Yo... Read More


US Patent Issued to SCREEN Holdings on Oct. 20 for "Substrate processing method and substrate processing apparatus" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,773, issued on Oct. 20, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan). "Substrate processing method and substrate processing appa... Read More


US Patent Issued to Kokusai Electric on Oct. 20 for "Substrate processing apparatus, inner tube and method of manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,774, issued on Oct. 20, was assigned to Kokusai Electric Corp. (Tokyo). "Substrate processing apparatus, inner tube and method of manufactu... Read More


US Patent Issued to ACM RESEARCH (SHANGHAI) on Oct. 20 for "Drying apparatus and method based on supercritical fluid" (Chinese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,775, issued on Oct. 20, was assigned to ACM RESEARCH (SHANGHAI) INC. (Shanghai). "Drying apparatus and method based on supercritical fluid"... Read More


US Patent Issued to Applied Materials on Oct. 20 for "Drying system with integrated substrate alignment stage" (California Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,776, issued on Oct. 20, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Drying system with integrated substrate alignment st... Read More


US Patent Issued to Mitsubishi Electric on Oct. 20 for "Method for manufacturing semiconductor apparatus and semiconductor manufacturing apparatus comprising amorphous layer between wafer and ring-shaped frame" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,777, issued on Oct. 20, was assigned to Mitsubishi Electric Corp. (Tokyo). "Method for manufacturing semiconductor apparatus and semiconduc... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Oct. 20 for "Substrate bonding apparatus and method of manufacturing semiconductor device using the same" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,778, issued on Oct. 20, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Substrate bonding apparatus and method of... Read More


US Patent Issued to Applied Materials on Oct. 20 for "Photo-emitting plasma for activation in processing chambers, and related apparatus and methods" (New York Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,779, issued on Oct. 20, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Photo-emitting plasma for activation in processing c... Read More