US Patent Issued to Kokusai Electric on Oct. 20 for "Substrate processing apparatus, inner tube and method of manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,774, issued on Oct. 20, was assigned to Kokusai Electric Corp. (Tokyo).

"Substrate processing apparatus, inner tube and method of manufacturing semiconductor device" was invented by Yusaku Okajima (Toyama, Japan), Takatomo Yamaguchi (Toyama, Japan), Yunosuke Sakai (Toyama, Japan) and Yoshinori Imai (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to one aspect of a technique the present disclosure, there is provided a processing apparatus including: an inner tube provided with a substrate accommodating region in which substrates are accommodated along an arrangement direction; an outer tube provided outside the inner tube; gas...