US Patent Issued to ASM IP Holding on Aug. 11 for "Susceptor for semiconductor substrate processing" (Arizona Inventors)

Posted On: 2026-08-12

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,938, issued on Aug. 11, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Susceptor for semiconductor substrate processing" was i... Read More

US Patent Issued to Applied Materials on Aug. 11 for "Substrate holder systems" (California Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,939, issued on Aug. 11, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Substrate holder systems" was invented by Chenfei Hu... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 11 for "Defect inspection system employing an image enhancing model and a defect detection model, and method of using the same" (Taiwanese Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,940, issued on Aug. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Defect inspection system employing ... Read More

US Patent Issued to Adeia Semiconductor Bonding Technologies on Aug. 11 for "Bonding surface validation on dicing tape" (California Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,941, issued on Aug. 11, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.). "Bonding surface validation on di... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Aug. 11 for "Semiconductor device" (South Korean Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,942, issued on Aug. 11, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device" was invented by Yongho... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Aug. 11 for "Method for semiconductor patterning using ion implanted organic masks" (South Korean Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,943, issued on Aug. 11, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Method for semiconductor patterning using io... Read More

US Patent Issued to SHIN-ETSU HANDOTAI on Aug. 11 for "Method for manufacturing SOI wafer and SOI wafer" (Japanese Inventor)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,944, issued on Aug. 11, was assigned to SHIN-ETSU HANDOTAI Co. LTD. (Tokyo). "Method for manufacturing SOI wafer and SOI wafer" was invente... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Aug. 11 for "Semiconductor device" (South Korean Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,945, issued on Aug. 11, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device" was invented by Jang H... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Aug. 11 for "Integrated circuit devices including metal structures having a curved interface and methods of forming the same" (New York Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,946, issued on Aug. 11, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Integrated circuit devices including metal s... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 11 for "Structures for reducing gap fill defects in a vertically stacked semiconductor device and methods for forming the same" (Taiwanese Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,947, issued on Aug. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Structures for reducing gap fill de... Read More

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US Patent Issued to ASM IP Holding on Aug. 11 for "Susceptor for semiconductor substrate processing" (Arizona Inventors)

US Patent Issued to Applied Materials on Aug. 11 for "Substrate holder systems" (California Inventors)

US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 11 for "Defect inspection system employing an image enhancing model and a defect detection model, and method of using the same" (Taiwanese Inventors)

US Patent Issued to Adeia Semiconductor Bonding Technologies on Aug. 11 for "Bonding surface validation on dicing tape" (California Inventors)

US Patent Issued to SAMSUNG ELECTRONICS on Aug. 11 for "Semiconductor device" (South Korean Inventors)

US Patent Issued to SAMSUNG ELECTRONICS on Aug. 11 for "Method for semiconductor patterning using ion implanted organic masks" (South Korean Inventors)

US Patent Issued to SHIN-ETSU HANDOTAI on Aug. 11 for "Method for manufacturing SOI wafer and SOI wafer" (Japanese Inventor)

US Patent Issued to SAMSUNG ELECTRONICS on Aug. 11 for "Semiconductor device" (South Korean Inventors)

US Patent Issued to SAMSUNG ELECTRONICS on Aug. 11 for "Integrated circuit devices including metal structures having a curved interface and methods of forming the same" (New York Inventors)

US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 11 for "Structures for reducing gap fill defects in a vertically stacked semiconductor device and methods for forming the same" (Taiwanese Inventors)