ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,941, issued on Aug. 11, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.).
"Bonding surface validation on dicing tape" was invented by Cyprian Emeka Uzoh (San Jose, Calif.) and Oliver Zhao (Sunnyvale, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "The disclosed technology relates to methods for forming and/or validating bonding surfaces of integrated device dies mounted on a dicing tape, and dicing tapes used thereof. In some embodiments, such a method for forming and validating a microelectronic assembly may include mounting a substrate to a dicing tape; singulating the substrate while the substrate is mounted ...