US Patent Issued to SAMSUNG ELECTRONICS on Aug. 11 for "Integrated circuit devices including metal structures having a curved interface and methods of forming the same" (New York Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,946, issued on Aug. 11, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Integrated circuit devices including metal structures having a curved interface and methods of forming the same" was invented by Jaemyung Choi (Niskayuna, N.Y.), Janggeun Lee (Delmar, N.Y.), Wonhyuk Hong (Clifton Park, N.Y.) and Kang-Ill Seo (Albany, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Integrated circuit devices and methods of forming the same are provided. The methods may include providing an underlying structure including a first insulating layer and forming a first metal structure, a first adhesion pattern, and a second insulating layer ...