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US Patent Issued to DB HITEK on June 23 for "Pillar structure and super junction semiconductor device including the same" (South Korean Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,663, issued on June 23, was assigned to DB HITEK Co. LTD. (Seoul, South Korea). "Pillar structure and super junction semiconductor device i... Read More


US Patent Issued to GlobalFoundries Singapore on June 23 for "Multiple-depth trench isolation for electrostatic discharge protection devices" (Singaporean, American Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,664, issued on June 23, was assigned to GlobalFoundries Singapore Pte. Ltd. (Singapore). "Multiple-depth trench isolation for electrostatic... Read More


US Patent Issued to Tokyo Electron on June 23 for "Method of 3D epitaxial growth for high density 3D horizontal nanosheets" (Texas, Florida Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,665, issued on June 23, was assigned to Tokyo Electron Ltd. (Tokyo). "Method of 3D epitaxial growth for high density 3D horizontal nanoshee... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 23 for "Semiconductor device structure and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,666, issued on June 23, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor device structure ... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on June 23 for "Transistor contacts and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,667, issued on June 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Transistor contacts and methods of ... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 23 for "Semiconductor devices with bonding layers" (Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,668, issued on June 23, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor devices with bond... Read More


US Patent Issued to Soochow University on June 23 for "Field-effect transistor device with equivalent source and drain region optimization" (Chinese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,669, issued on June 23, was assigned to Soochow University (Suzhou City, China). "Field-effect transistor device with equivalent source and... Read More


US Patent Issued to FUJI ELECTRIC on June 23 for "Semiconductor apparatus and manufacturing method of semiconductor apparatus having a hydrogen increasing portion" (Japanese Inventor)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,672, issued on June 23, was assigned to FUJI ELECTRIC Co. LTD. (Kanagawa, Japan). "Semiconductor apparatus and manufacturing method of semi... Read More


US Patent Issued to MQSEMI on June 23 for "Semiconductor device" (Swiss Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,673, issued on June 23, was assigned to MQSEMI AG (Zug, Switzerland). "Semiconductor device" was invented by Munaf Rahimo (Gaensbrunnen, Sw... Read More


US Patent Issued to Samsung Display on June 23 for "Display panel, method of manufacturing the display panel, and electronic apparatus including the display panel" (South Korean Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,846, issued on June 23, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display panel, method of manufacturing the disp... Read More