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US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 11 for "Method of manufacturing semiconductor devices including a cap insulating layer" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,905, issued on Aug. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Method of manufacturing semicon... और पढ़ें


US Patent Issued to Versum Materials US on Aug. 11 for "Selective thermal atomic layer deposition" (American, Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,906, issued on Aug. 11, was assigned to Versum Materials US LLC (Tempe, Ariz.). "Selective thermal atomic layer deposition" was invented by... और पढ़ें


US Patent Issued to Yale University on Aug. 11 for "Control and localization of porosity in III-nitrides and methods of using and making thereof" (Connecticut Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,907, issued on Aug. 11, was assigned to Yale University (New Haven, Conn.). "Control and localization of porosity in III-nitrides and metho... और पढ़ें


US Patent Issued to Resonac on Aug. 11 for "Etching method and semiconductor element manufacturing method" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,908, issued on Aug. 11, was assigned to Resonac Corp. (Tokyo). "Etching method and semiconductor element manufacturing method" was invented... और पढ़ें


US Patent Issued to Tokyo Electron on Aug. 11 for "Etching method" (Japanese, American Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,909, issued on Aug. 11, was assigned to Tokyo Electron Ltd. (Tokyo). "Etching method" was invented by Maju Tomura (Miyagi, Japan), Takatosh... और पढ़ें


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 11 for "Hard mask layer and formation method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,910, issued on Aug. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Hard mask layer and formation m... और पढ़ें


US Patent Issued to Applied Materials on Aug. 11 for "Introduction of metal in hard mask for high aspect ratio device patterning" (California Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,911, issued on Aug. 11, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Introduction of metal in hard mask for high aspect r... और पढ़ें


US Patent Issued to UTAC Headquarters on Aug. 11 for "Plasma diced wafers and methods thereof" (Singaporean Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,912, issued on Aug. 11, was assigned to UTAC Headquarters Pte. Ltd. (Singapore). "Plasma diced wafers and methods thereof" was invented by ... और पढ़ें


US Patent Issued to SEMES on Aug. 11 for "Apparatus and method for processing substrate using supercritical fluid" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,913, issued on Aug. 11, was assigned to SEMES Co. Ltd. (Cheonan-si, South Korea). "Apparatus and method for processing substrate using supe... और पढ़ें


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 11 for "Liquid dispensing system and methods" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,914, issued on Aug. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Liquid dispensing system and me... और पढ़ें