ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,189, issued on Aug. 25, was assigned to Rohm Co. Ltd. (Kyoto, Japan). "Junction structure and semiconductor device" was invented by Kohei T... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,190, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package" was invented by Seok ... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,191, issued on Aug. 25, was assigned to Volantis Semiconductor Inc. (Portland, Ore.). "Back side power delivery for wafer-scale integration... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,192, issued on Aug. 25, was assigned to Intel Corp. (Santa Clara, Calif.). "Via micro-modules for through mold via replacement" was invente... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,193, issued on Aug. 25, was assigned to Intel Corp. (Santa Clara, Calif.). "Self-alignment of glass core halves using protruded bumps" was ... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,194, issued on Aug. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Integrated circuit packages and met... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,195, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and manufacturing meth... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,196, issued on Aug. 25, was assigned to ROHM Co. LTD. (Kyoto, Japan). "Semiconductor device with detection electrode" was invented by Taday... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,197, issued on Aug. 25, was assigned to Niterra Materials Co. Ltd. (Yokohama, Japan). "Insulating circuit board and semiconductor device us... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,198, issued on Aug. 25, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Package structure and method for manufacturing t... Read More