US Patent Issued to SAMSUNG ELECTRONICS on Aug. 25 for "Semiconductor package and manufacturing method thereof" (South Korean Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,195, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package and manufacturing method thereof" was invented by Keunyoung Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a substrate. A pattern layer is disposed on a first surface of the substrate. The pattern layer includes a plurality of pads and a plating wire positioned between adjacent pads of the plurality of pads. A first protection layer is disposed on the first surface of the substrate to cover the pattern layer and expose the plurality of pads. At least one pad of the plurality ...