US Patent Issued to Niterra Materials on Aug. 25 for "Insulating circuit board and semiconductor device using same" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,197, issued on Aug. 25, was assigned to Niterra Materials Co. Ltd. (Yokohama, Japan).

"Insulating circuit board and semiconductor device using same" was invented by Kazumitsu Morimoto (Yokohama Kanagawa, Japan) and Hideaki Hirabayashi (Yokohama Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to the embodiment, in an insulating circuit board in which a conductor part is bonded to at least one surface of an insulating substrate, in XPS analysis of the carbon amount at the surface of the conductor part, the average value of the carbon amounts at any three locations is within the range of not less than 0 at % and not more than 7...