US Patent Issued to Intel on Aug. 25 for "Via micro-modules for through mold via replacement" (Arizona Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,192, issued on Aug. 25, was assigned to Intel Corp. (Santa Clara, Calif.).

"Via micro-modules for through mold via replacement" was invented by Adel A. Elsherbini (Tempe, Ariz.) and Telesphor Kamgaing (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein include die modules, electronic packages, and systems. In an embodiment, a die module comprises a first substrate and a first die over the first substrate. In an embodiment, the die module further comprises a second die over the first substrate adjacent to the first die. In an embodiment, the die module further comprises a via module through the first substrate...