US Patent Issued to Volantis Semiconductor on Aug. 25 for "Back side power delivery for wafer-scale integration with solderless modular power substrates" (California Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,191, issued on Aug. 25, was assigned to Volantis Semiconductor Inc. (Portland, Ore.).

"Back side power delivery for wafer-scale integration with solderless modular power substrates" was invented by Tapabrata Ghosh (Oakland, Calif.) and Kevin Nan Lam (Pleasanton, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Techniques for power delivery are disclosed. A wafer-scale silicon interposer (WSSI) is accessed. A front side of the WSSI is bonded to a plurality of functional chips. The WSSI includes a plurality of through-silicon vias (TSVs). A plurality of modular power substrates (MPSs) is connected mechanically to a unified control board (UCB). Th...