US Patent Issued to Rohm on Aug. 25 for "Junction structure and semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,189, issued on Aug. 25, was assigned to Rohm Co. Ltd. (Kyoto, Japan).

"Junction structure and semiconductor device" was invented by Kohei Tanikawa (Kyoto, Japan) and Oji Sato (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A junction structure includes a conductive substrate having a conductive section, a terminal including an electro-conductive tubular holder, and a metal pin inserted into the holder, and a conductive bonding material bonding the conductive section and the holder. The metal pin includes a straight portion extending along a thickness direction of the conductive section. The holder includes a first through-hole extending...