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US Patent Issued to Applied Materials on Aug. 25 for "Heated lid for a process chamber" (Indian Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,087, issued on Aug. 25, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Heated lid for a process chamber" was invented by Sh... Read More


US Patent Issued to Tokyo Electron on Aug. 25 for "Semiconductor high pressure annealing device" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,088, issued on Aug. 25, was assigned to Tokyo Electron Ltd. (Tokyo). "Semiconductor high pressure annealing device" was invented by Cheng-H... Read More


US Patent Issued to Applied Materials on Aug. 25 for "Multi-zone lamp heating for chemical vapor deposition" (American, Indian Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,089, issued on Aug. 25, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Multi-zone lamp heating for chemical vapor depositio... Read More


US Patent Issued to Nexperia on Aug. 25 for "Adhesive dispense unit" (Dutch Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,090, issued on Aug. 25, was assigned to Nexperia B.V. (Nijmegen, Netherlands). "Adhesive dispense unit" was invented by Erik Eltink (Nijmeg... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 25 for "Systems and methods for shuttered wafer cleaning" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,091, issued on Aug. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Systems and methods for shuttered w... Read More


US Patent Issued to Lam Research on Aug. 25 for "Method for arranging a semiconductor processing tool on a pedestal" (California Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,092, issued on Aug. 25, was assigned to Lam Research Corp. (Fremont, Calif.). "Method for arranging a semiconductor processing tool on a pe... Read More


US Patent Issued to Kokusai Electric on Aug. 25 for "Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus and non-transitory computer-readable recording medium" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,093, issued on Aug. 25, was assigned to Kokusai Electric Corp. (Tokyo). "Method of manufacturing semiconductor device, substrate processing... Read More


US Patent Issued to Applied Materials on Aug. 25 for "Automated substrate placement to chamber center" (California Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,094, issued on Aug. 25, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Automated substrate placement to chamber center" was... Read More


US Patent Issued to Tokyo Electron on Aug. 25 for "Conveyance method and processing system" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,095, issued on Aug. 25, was assigned to Tokyo Electron Ltd. (Tokyo). "Conveyance method and processing system" was invented by Wataru Nakag... Read More


US Patent Issued to Nexperia on Aug. 25 for "Pick-and-place apparatus and method" (Dutch Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,096, issued on Aug. 25, was assigned to Nexperia B.V. (Nijmegen, Netherlands). "Pick-and-place apparatus and method" was invented by Steven... Read More