US Patent Issued to Nexperia on Aug. 25 for "Adhesive dispense unit" (Dutch Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,090, issued on Aug. 25, was assigned to Nexperia B.V. (Nijmegen, Netherlands).

"Adhesive dispense unit" was invented by Erik Eltink (Nijmegen, Netherlands) and Theo ter Steeg (Nijmegen, Netherlands).

According to the abstract* released by the U.S. Patent & Trademark Office: "This disclosure relates to an adhesive dispense unit for a semiconductor die bonding apparatus. The adhesive dispense unit includes an adhesive dispense nozzle and a pin member; the pin member comprising a down stand portion and a sheath portion, and the down stand is reciprocatable within the sheath portion."

The patent was filed on Aug. 11, 2023, under Application No. 18/448,659.

*For further information,...