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US Patent Issued to WUXI LEAPERS SEMICONDUCTOR on Sept. 29 for "Power semiconductor module" (Chinese Inventor)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,317, issued on Sept. 29, was assigned to WUXI LEAPERS SEMICONDUCTOR Co. LTD. (Wuxi, China). "Power semiconductor module" was invented by X... और पढ़ें


US Patent Issued to FUJI ELECTRIC on Sept. 29 for "Semiconductor module" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,318, issued on Sept. 29, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor module" was invented by Daisuke Inoue (M... और पढ़ें


US Patent Issued to LG Electronics, LG DISPLAY on Sept. 29 for "Display apparatus" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,319, issued on Sept. 29, was assigned to LG Electronics Inc. (Seoul, South Korea) and LG DISPLAY Co. LTD. (Seoul, South Korea). "Display a... और पढ़ें


US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 29 for "Chip-on-wafer-on-board structure using spacer die and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,320, issued on Sept. 29, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Chip-on-wafer-on-board structure ... और पढ़ें


US Patent Issued to Amkor Technology Singapore Holding on Sept. 29 for "Electronic devices and methods of manufacturing electronic devices" (Arizona Inventor)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,321, issued on Sept. 29, was assigned to Amkor Technology Singapore Holding Pte. Ltd. (Singapore). "Electronic devices and methods of manu... और पढ़ें


US Patent Issued to Xiamen Tianma Microelectronics on Sept. 29 for "Display panel and display device" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,322, issued on Sept. 29, was assigned to Xiamen Tianma Microelectronics Co. Ltd. (Xiamen, China). "Display panel and display device" was i... और पढ़ें


US Patent Issued to Adeia Semiconductor Bonding Technologies on Sept. 29 for "Direct bonding methods and structures" (California Inventor)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,323, issued on Sept. 29, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.). "Direct bonding methods and str... और पढ़ें


US Patent Issued to SAMSUNG ELECTRONICS on Sept. 29 for "Semiconductor package manufactured through a thermocompression process using a non-conductive film (NCF)" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,324, issued on Sept. 29, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package manufactured through... और पढ़ें


US Patent Issued to Jiangxi MTC Visual Display on Sept. 29 for "Data and scanning lines pattern of an LED panel structure" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,325, issued on Sept. 29, was assigned to Jiangxi MTC Visual Display Co. Ltd (Nanchang, China). "Data and scanning lines pattern of an LED ... और पढ़ें


US Patent Issued to Sandisk Technologies on Sept. 29 for "Stacked chip scale semiconductor device" (Malaysian Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,326, issued on Sept. 29, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.). "Stacked chip scale semiconductor device" was inven... और पढ़ें