US Patent Issued to FUJI ELECTRIC on Sept. 29 for "Semiconductor module" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,318, issued on Sept. 29, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).

"Semiconductor module" was invented by Daisuke Inoue (Matsumoto-city, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a semiconductor module that can reduce the assembly tolerance between a case part and a base part. A semiconductor module includes: a base part having a plurality of semiconductor elements and a cooling unit configured to cool the plurality of semiconductor elements; a case part attached to the base part and defining a space in which the plurality of semiconductor elements is disposed; a first protruding portion having a shape i...