ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,317, issued on Sept. 29, was assigned to WUXI LEAPERS SEMICONDUCTOR Co. LTD. (Wuxi, China).
"Power semiconductor module" was invented by Xiaoguang Liang (Wuxi, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "A power semiconductor module includes a metal bottom plate, an insulating heat dissipation material layer, a chip, a binding plate, silica gel, and an outer housing, where the binding plate includes a copper plate and a copper strap. The copper plate is connected to the copper strap through welding, and the binding plate is configured to connect circuits of various components. The metal bottom plate is connected to the insulating heat diss...