US Patent Issued to SAMSUNG ELECTRONICS on Sept. 29 for "Semiconductor package manufactured through a thermocompression process using a non-conductive film (NCF)" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,324, issued on Sept. 29, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package manufactured through a thermocompression process using a non-conductive film (NCF)" was invented by Hyunsoo Chung (Suwon-si, South Korea), Younglyong Kim (Suwon-si, South Korea) and Inhyo Hwang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes: a buffer die; a first core die disposed on the buffer die; a second core die disposed on the first core die; a first non-conductive film (NCF) disposed between the first core die and the second core die and bonding the first core die and th...