US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 29 for "Chip-on-wafer-on-board structure using spacer die and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,320, issued on Sept. 29, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Chip-on-wafer-on-board structure using spacer die and methods of forming the same" was invented by Sheng-Kai Chang (Taipei City, Taiwan), Leo Li (Hsinchu, Taiwan), Chung-Hsien Hun (Zhubei City, Taiwan), Lieh-Chuan Chen (Hsinchu City, Taiwan) and Chien-Li Kuo (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure may include an interposer including on-interposer bump structures, at least one semiconductor die bonded to a first subset of the on-interposer bump structures through first solder material portion...