US Patent Issued to Sandisk Technologies on Sept. 29 for "Stacked chip scale semiconductor device" (Malaysian Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,326, issued on Sept. 29, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.).

"Stacked chip scale semiconductor device" was invented by Chee Seng Wong (Penang, Malaysia), Yoong Tatt Chin (Penang, Malaysia) and Wei Chiat Teng (Penang, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "A stacked chip scale semiconductor device includes one or more semiconductor die stacks. Each semiconductor die stack may include a pair of semiconductor dies. A first of the pair of semiconductor dies may be provided with a pattern of contact pads distributed across its major surface configured to be flip chip bonded to a host device. A second of the pai...