ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,632, issued on Sept. 22, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.). "Memory device and method of assembling same" was i... और पढ़ें
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,633, issued on Sept. 22, was assigned to MITSUBISHI ELECTRIC Corp. (Tokyo). "Semiconductor module and power converter" was invented by Sho... और पढ़ें
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,635, issued on Sept. 22, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor device" was invented by Sota Yamaguchi (... और पढ़ें
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,636, issued on Sept. 22, was assigned to Marel Power Solutions (Plymouth, Mich.). "Liquid cooled compact power systems" was invented by Ia... और पढ़ें
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,637, issued on Sept. 22, was assigned to Huawei Digital Power Technologies Co. Ltd. (Shenzhen, China). "Power semiconductor module and man... और पढ़ें
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,638, issued on Sept. 22, was assigned to Frore Systems Inc. (San Jose, Calif.). "Piezoelectric MEMS-based active cooling for heat dissipat... और पढ़ें
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,639, issued on Sept. 22, was assigned to Board Of Trustees Of The University Of Arkansas (Little Rock, Ark.). "Apparatus and method to red... और पढ़ें
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,640, issued on Sept. 22, was assigned to Mitsubishi Electric Corp. (Tokyo). "Semiconductor device, power conversion device and moving body... और पढ़ें
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,641, issued on Sept. 22, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor devices with du... और पढ़ें
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,642, issued on Sept. 22, was assigned to Intel Corp. (Santa Clara, Calif.). "Device, method, and system to mitigate warpage of a composite... और पढ़ें