ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,639, issued on Sept. 22, was assigned to Board Of Trustees Of The University Of Arkansas (Little Rock, Ark.).
"Apparatus and method to reduce the thermal resistance of semiconductor substrates" was invented by Amirreza Ghadimi Avval (Fayetteville, Ark.), Samir El-Ghazaly (Fayetteville, Ark.), Gregory J. Salamo (Fayetteville, Ark.) and Shui-Qing Yu (Fayetteville, Ark.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor heat sink made of a first material including a plurality of spaced-apart depressions and an area surrounding the depressions filled with one or more materials having a heat conductivity greater than the first material."
Th...