US Patent Issued to MITSUBISHI ELECTRIC on Sept. 22 for "Semiconductor module and power converter" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,633, issued on Sept. 22, was assigned to MITSUBISHI ELECTRIC Corp. (Tokyo).

"Semiconductor module and power converter" was invented by Shotaro Yamamoto (Tokyo), Yoshiko Tamada (Tokyo), Kazuya Okada (Tokyo) and Seiji Oka (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor module includes a semiconductor chip, an insulating substrate, a relay board, and a heat-dissipating component. The insulating substrate includes a main circuit pattern and an insulating layer. The main circuit pattern is electrically connected to the semiconductor chip. The relay board sandwiches the semiconductor chip together with the main circuit pattern in a ...