US Patent Issued to Mitsubishi Electric on Sept. 22 for "Semiconductor device, power conversion device and moving body" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,640, issued on Sept. 22, was assigned to Mitsubishi Electric Corp. (Tokyo).

"Semiconductor device, power conversion device and moving body" was invented by Yukimasa Hayashida (Fukuoka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Failure analysis and recycle of a semiconductor device are facilitated, and a production efficiency of the semiconductor device is improved. An exterior includes an inner space and an inner surface surrounding the inner space. A semiconductor chip is housed in the inner space and mounted on the inner surface. A first sealing material fills the inner space, is disposed on the inner surface to be overlapped on the se...