US Patent Issued to Sandisk Technologies on Sept. 22 for "Memory device and method of assembling same" (Malaysian Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,632, issued on Sept. 22, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.).

"Memory device and method of assembling same" was invented by Chee Seng Wong (Penang, Malaysia), Yoong Tatt Chin (Penang, Malaysia) and Wei Chiat Teng (Penang, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "Technology for a memory device having memory dies flip-chip bonded to one or more interposers that are mounted to a system board is disclosed. The memory device may be an SSD and the system board may be an M.2 board. A memory controller die may be bonded to one of the interposer boards. In one aspect, the memory controller die is flip-chip bonded to t...