US Patent Issued to Intel on Sept. 22 for "Device, method, and system to mitigate warpage of a composite chiplet" (Arizona, Oregon Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,642, issued on Sept. 22, was assigned to Intel Corp. (Santa Clara, Calif.).

"Device, method, and system to mitigate warpage of a composite chiplet" was invented by Adel Elsherbini (Chandler, Ariz.), Lance C. Hibbeler (Tillamook, Ore.), Omkar Karhade (Chandler, Ariz.), Chytra Pawashe (Portland, Ore.), Kimin Jun (Portland, Ore.), Feras Eid (Chandler, Ariz.), Shawna Liff (Scottsdale, Ariz.), Mohammad Enamul Kabir (Portland, Ore.), Bhaskar Jyoti Krishnatreya (Hillsboro, Ore.), Tushar Talukdar (Wilsonville, Ore.) and Wenhao Li (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Techniques and mechanisms to mitigate warping of a composite chi...