ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,547, issued on July 28, was assigned to Mitsubishi Electric Corp. (Tokyo). "Transformer device and semiconductor device" was invented by To... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,548, issued on July 28, was assigned to Hefei Polytechnic University (Hefei, China). "Three-dimensional framework silicon/perovskite tandem... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,549, issued on July 28, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Energy harvest and storage device f... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,550, issued on July 28, was assigned to THE BOEING COMPANY (Arlington, Va.). "Power routing module with a switching matrix for a solar cell... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,551, issued on July 28, was assigned to JINKO SOLAR (HAINING) Co. LTD. (Haining, China). "Photovoltaic module and method for manufacturing ... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,552, issued on July 28. "Diode radiation sensor" was invented by Alberto Gola (Trento, Italy), Fabio Acerbi (Trento, Italy), Giacomo Borghi... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,553, issued on July 28, was assigned to KLA Corp. (Milpitas, Calif.). "Back-illuminated sensor and a method of manufacturing a sensor using... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,554, issued on July 28, was assigned to Beijing North Gaoye Technology Co. Ltd. (Beijing). "Infrared detector with multi-layer structure ba... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,555, issued on July 28, was assigned to PixArt Imaging Inc. (Hsin-Chu City, Taiwan). "Photodiode and manufacturing method thereof" was inve... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,556, issued on July 28, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Bond pad structure for bonding impr... Read More