US Patent Issued to JCET STATS ChipPAC Korea on June 16 for "Semiconductor device and method of forming an antenna-in-package structure" (South Korean Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,673, issued on June 16, was assigned to JCET STATS ChipPAC Korea Ltd. (South Korea). "Semiconductor device and method of forming an antenna... Read More

US Patent Issued to SCHOTT on June 16 for "Hermetically sealed glass package including a heat-dissipating base substrate, a cap, and a laser bonding line" (German, Japanese, Finnish Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,674, issued on June 16, was assigned to SCHOTT AG (Mainz, Germany). "Hermetically sealed glass package including a heat-dissipating base su... Read More

US Patent Issued to FUJI ELECTRIC on June 16 for "Semiconductor module" (Japanese Inventor)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,675, issued on June 16, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor module" was invented by Hayato Nakano (Yam... Read More

US Patent Issued to SAMSUNG ELECTRONICS on June 16 for "Semiconductor package with semiconductor devices" (South Korean Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,677, issued on June 16, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package with semiconductor dev... Read More

US Patent Issued to Infineon Technologies Austria on June 16 for "Embedded package with delamination mitigation" (German, Austrian Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,678, issued on June 16, was assigned to Infineon Technologies Austria AG (Villach, Austria). "Embedded package with delamination mitigation... Read More

US Patent Issued to FUJI ELECTRIC on June 16 for "Semiconductor module" (Japanese Inventor)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,679, issued on June 16, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor module" was invented by Hayato Nakano (Kof... Read More

US Patent Issued to Intel on June 16 for "Substrate architecture for enhanced electrostatic chucking" (Arizona Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,680, issued on June 16, was assigned to Intel Corp. (Santa Clara, Calif.). "Substrate architecture for enhanced electrostatic chucking" was... Read More

US Patent Issued to FUJI ELECTRIC on June 16 for "Module-type semiconductor device and method of manufacturing module-type semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,681, issued on June 16, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Module-type semiconductor device and method of manufactu... Read More

US Patent Issued to Advanced Micro Devices on June 16 for "Die stacking for modular parallel processors" (Florida Inventor)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,682, issued on June 16, was assigned to Advanced Micro Devices Inc. (Santa Clara, Calif.). "Die stacking for modular parallel processors" w... Read More

US Patent Issued to Groq on June 16 for "Tile structures for multiple die tensor streaming processors" (California Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,683, issued on June 16, was assigned to Groq Inc. (San Jose, Calif.). "Tile structures for multiple die tensor streaming processors" was in... Read More

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