US Patent Issued to FUJI ELECTRIC on June 16 for "Semiconductor module" (Japanese Inventor)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,679, issued on June 16, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).

"Semiconductor module" was invented by Hayato Nakano (Kofu-city, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a semiconductor module capable of preventing the adhesion of an epoxy resin to terminals to which at least one of a large current and a high voltage is supplied. A semiconductor module includes: a sealing section formed of an epoxy resin and sealing transistors; an intermediate terminal having a fastening surface to which a cable connected to a load as a drive target is fastened in a direction intersecting the thickness direction of a ...