ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,682, issued on June 16, was assigned to Advanced Micro Devices Inc. (Santa Clara, Calif.).
"Die stacking for modular parallel processors" was invented by Michael Mantor (Orlando, Fla.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multi-die parallel processor semiconductor package includes a first base IC die including a first plurality of virtual compute dies 3D stacked on top of the first base IC die. A first subset of a parallel processing pipeline logic is positioned at the first plurality of virtual compute dies. Additionally, a second subset of the parallel processing pipeline logic is positioned at the first base IC die. The multi-die paral...