US Patent Issued to FUJI ELECTRIC on June 16 for "Module-type semiconductor device and method of manufacturing module-type semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,681, issued on June 16, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).

"Module-type semiconductor device and method of manufacturing module-type semiconductor device" was invented by Daisuke Kimijima (Matsumoto-city, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a substrate having a first main surface on which a semiconductor chip is mounted, a case adhered to a peripheral edge of the substrate to form a recess in which the semiconductor chip is disposed, a cover disposed in the case with a first gap in a direction parallel to the first main surface between the cover and the case such that a second m...