US Patent Issued to FUJI ELECTRIC on June 16 for "Semiconductor module" (Japanese Inventor)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,675, issued on June 16, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).

"Semiconductor module" was invented by Hayato Nakano (Yamanashi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "[Problem] An object of the present invention is to provide a semiconductor module capable of preventing a wire wiring from being broken because of a crack having occurred in sealing resin.[Solution] A semiconductor module 1 includes semiconductor chips 14a to 14d, sealing resin 18 configured to seal the semiconductor chips 14a to 14d, a case 11 including a casting area 117u, first portions 111 and 112, and second portions 113 and 114, wire wirings 101a ...