US Patent Issued to Infineon Technologies Austria on June 16 for "Embedded package with delamination mitigation" (German, Austrian Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,678, issued on June 16, was assigned to Infineon Technologies Austria AG (Villach, Austria).

"Embedded package with delamination mitigation" was invented by Bernd Schmoelzer (Radenthein, Austria), Edward Fuergut (Dasing, Germany), Ivan Nikitin (Regensburg, Germany) and Wolfgang Scholz (Olching, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor assembly includes a laminate substrate that includes a plurality of laminate layers of electrically insulating material stacked on top of one another, a semiconductor package that includes a package body of electrically insulating encapsulant material and a plurality of electrical contacts...