ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,979, issued on Aug. 4, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Interconnection structure and met... और पढ़ें
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,980, issued on Aug. 4, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Layer-by-layer formation of throu... और पढ़ें
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,981, issued on Aug. 4, was assigned to KIOXIA Corp. (Tokyo). "Semiconductor device and semiconductor memory device, and method for manufactu... और पढ़ें
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,982, issued on Aug. 4, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor structure and manuf... और पढ़ें
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,983, issued on Aug. 4, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Integrated circuit device and man... और पढ़ें
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,984, issued on Aug. 4, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Self-aligned via in double diffusion break to ... और पढ़ें
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,985, issued on Aug. 4, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor device and method for fabrica... और पढ़ें
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,986, issued on Aug. 4, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Wet recess for Ru subtractive process" was inv... और पढ़ें
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,987, issued on Aug. 4, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor devices including conductive str... और पढ़ें
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,988, issued on Aug. 4, was assigned to INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES (Beijing). "Metal interconnection structur... और पढ़ें