ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,985, issued on Aug. 4, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).
"Semiconductor device and method for fabricating the same" was invented by Jee Woong Kim (Suwon-si, South Korea), Jin Kyu Kim (Suwon-si, South Korea), Ho Jun Kim (Suwon-si, South Korea), Jae Hyun Ahn (Suwon-si, South Korea) and So Ra You (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device having simplicity in design and improved performance and methods for fabricating the same are provided. The semiconductor device includes a substrate including a frontside and a backside opposite the frontside, an electronic device...