ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,015, issued on June 23, was assigned to Mitsubishi Electric Corp. (Tokyo). "Semiconductor device with pairs of signal pads concentrated on ... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,016, issued on June 23, was assigned to Hue Inc. (Shanghai). "Micro package structure" was invented by Yang Yue (Shanghai). According to t... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,017, issued on June 23, was assigned to Seoul Viosys Co. Ltd. (Gyeonggi-do, South Korea). "Light emitting device module and display apparat... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,018, issued on June 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device including mult... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,019, issued on June 23, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package" was invented by Hongj... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,020, issued on June 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Hybrid underfill structures for mul... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,021, issued on June 23, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Method for manufacturing semiconductor module" was inven... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,022, issued on June 23, was assigned to Eliyan Corp. (Santa Clara, Calif.). "Complex system-in-package architectures leveraging high-bandwi... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,023, issued on June 23, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Package device including capacitor disposed ... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,024, issued on June 23, was assigned to Apple Inc. (Cupertino, Calif.). "Barriers for selective exposed molding of variable height componen... Read More