US Patent Issued to SAMSUNG ELECTRONICS on June 23 for "Package device including capacitor disposed on opposite side of die relative to substrate" (South Korean Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,023, issued on June 23, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Package device including capacitor disposed on opposite side of die relative to substrate" was invented by Sangho Lee (Suwon-si, South Korea), Kihyun Kim (Suwon-si, South Korea), Sangyong Park (Suwon-si, South Korea), Kwanghyun Baek (Suwon-si, South Korea) and Seungjae Baek (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package device is provided. The package device includes a substrate, a plurality of upper lands disposed on one surface of the substrate, a plurality of upper solder balls disposed on the plurality of upper lands, a...