ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,021, issued on June 23, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).
"Method for manufacturing semiconductor module" was invented by Tatsuo Nishizawa (Matsumoto-city, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a semiconductor module includes arranging an insulating wiring board on a lower die, arranging sintered materials at a plurality of points on the insulating wiring board, arranging each semiconductor chip on the sintered materials, arranging each buffer material individually on the semiconductor chips, arranging, above the lower die, an upper die including protrusions at points corresponding to...