ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,016, issued on June 23, was assigned to Hue Inc. (Shanghai).
"Micro package structure" was invented by Yang Yue (Shanghai).
According to the abstract* released by the U.S. Patent & Trademark Office: "A micro package structure includes a micro LED panel including an IC (integrated circuit) substrate and an micro LED array area formed on the IC substrate; a top cover plane formed above the micro LED panel, so that light emitted from the micro LED array area is transmitted upward to the top cover plane; and a seal structure formed between an edge of the micro LED panel and an edge of the top cover plane around the micro LED array area."
The patent was filed on May 31, 2023, under A...